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    Ceramics powder and other products

    Ceramics powder and other products:

    We produce all kinds of ceramic powder, mainly AlN, TiC, TiCN, TiB2, BN, SiC, Si3N4, Sialon, Cr3C2, MoSi2, XTiY, etc. by self-propagating high temperature synthesis technology. More can also be produced based on customers’ demand. This technology gives products completed reaction, stable performance and good quality. Yield capacity: 30t/year



    Standard and Application

    Product

    Component,wt%

    Particle Size
    μm

    Application

    N

    C

    C.free

    E

    O

    AlN

    ≥32.5

    ≤0.1


    Fe≤0.1

    ≤1.0

    ≤0.5

    Additives, high temperature structural ceramics and electronic circuit substrate, the evaporation boat, electronic packaging, thermal coated

    TiN

    ≥21



    Fe≤0.1

    ≤1.0

    ≤4.0

    cutter, coating

    TiC


    ≥19.5

    ≤0.3

    Fe≤0.1

    ≤1.0

    ≤4.0

    cutter,grinder

    TiCN

    C/N adjustable

    ≤0.3

    Fe≤0.1

    ≤1.0

    ≤3.0

    cutter,grinder

    TiB2


    B≥26


    Fe≤0.1
    Mg≤0.2
    B2O3≤0.2

    ≤1.0

    ≤4.0

    Ceramic cutting tool structure, conductive ceramics, abrasives, evaporation boat

    h-BN(Ⅰ)

    ≥55

    ≤0.08


    Fe≤0.005
    Mg≤0.2
    B2O3≤0.1

    ≤0.5

    ≤1.0

    Cubic BN raw materials, high performance components, cosmetic additives

    h-BN(Ⅱ)

    ≥53

    ≤0.2


    Fe≤0.2
    B2O3≤0.5

    ≤1.5

    ≤4.0

    High temperature insulation, solid lubricant, coating agent, evaporation boat

    β-SiC


    ≥28

    ≤0.3

    Fe≤0.2

    ≤0.8

    ≤0.5

    the structure of the evaporation boat knives, pottery and porcelain, abrasive

    Si3N4

    ≥37.5

    ≤0.2


    Fe≤0.2
    Si,free≤0.7

    ≤1.5

    ≤0.5
    ≤5.0

    Cutting tools, structural ceramics, high temperature structure, wear-resisting material

    β-Sialon

    Z adjustable

    ≤0.5


    ≤3.0

    Cutting tools, structural ceramics

    MoSi2

    Si≥21

    ≤0.1


    Fe≤0.2
    Si,free≤0.7

    ≤1.0

    ≤3.0

    heating parts

    Cr3C2


    ≥12.5

    ≤0.3

    Fe≤0.2

    ≤1.0

    ≤3.0

    Welding, spraying, wear-resisting material, cutting tool

    XTiY

    X,Y adjustable

    Fe≤0.2


    ≤3.0

    Welding, spraying, wear-resisting material, cutting tool

    TiB2·Al2O3

    TiB2·Al2O3 adjustable

    Fe≤0.2


    ≤3.0

    wear-resisting material, cutter


    Production Process:


    Aluminum Nitride Ceramic Products:

    1.Property and Application:

    Aluminum nitride ceramic is an ideal dissipation and packaging material for large-scale integrated circuits, semiconductor module circuit and high power device of new generation. It is the perfect additive to improve heat conductivity and mechanical ability of polymer materials.

    Aluminum nitride ceramic can also be made for smelting non-ferrous metal and semiconductor gallium arsenide crucible, evaporation boat, thermocouple protection tube, high temperature insulation parts, microwave dielectric ceramic material, high-demand ceramic products.

    2.Specification of Aluminum nitride powder:

    Sample Name

    N (wt%)

    O (wt%)

    Fe (wt%)

    Cr (wt%)

    Ni (wt%)

    K (wt%)

    Na (wt%)

    AlN -12

    >32.5

    <1

    <0.05

    <0.005

    <0.005

    <0.005

    <0.005

    AlN -15

    >32.5

    <1

    <0.05

    <0.005

    <0.005

    <0.005

    <0.005

    AlN -20

    >32.5

    <1

    <0.05

    0

    0

    0

    0

    3.ALN substration: 

    With the good heat conductivity, insulation, heat corrosive and corrosion resistance, ALN is widely applied in power module, micro –electric package and temperature-protecting pipes and other fields.

    Comparison between ALN substration and other ceramic substration:

    property

    AlN

    SiC

    Al2O3

    BeO

    BN

    Thermal conductivity (W/mK) (at room temperature)

    >150

    270

    20

    250

    20-60

    Electrical resistivity(Ωm) (at room temperature)

    >1012

    >1012

    >1012

    >1012

    >1012

    Dielectric strength(105V/m) (at room temperature)

    140-170

    0.7

    100

    100-140

    300-400

    Dielectric constant(at room temperature 1MHz)

    8.8

    45

    8.5

    6.7

    40

    Tgδ(10-4)(at room temperature 1MHz)

    5-10

    500

    3

    4-7

    2-6

    Coefficient of expansion(10-6K-1)

    4.5

    3.7

    7.3

    7.2

    0.0

    Moduous of elasticity(GPa)

    3.3

    3.2

    3.9

    2.9

    2.3

    Bending strength(MPa)

    392-490

    441

    196-294

    167-225

    980

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