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    Home > Products > Heat Sinks for Electronic Packaging
    Pure Molybdenum

    Pure Molybdenum

    Product Brief Introduction:

    - Molybdenum is similar to Tungsten, with melting point of 2,620 ℃(4,753oF), a little lower than tungsten. The elongation ability is better than Tungsten, and it is easier to make the thin wires and thin foils.
    - It has the lowest coefficient of thermal expansion (CTE) of any pure metals, its CTE matches well with semiconductor materials, such as, Si, GaN, GaAs, Al2O3.


      

    Product Properties:

    Density: 10.2g/cm3
    Melting Point: 2620 ℃
    CTE (20-2000℃): 4.9*10-6/K
    Thermal Conductivity: 138 W/(M.K)

    Application: 

    Pure molybdenum products are widely used for Furnace parts,Semiconductor Base Plates, Components for Electron Tubes, Emission Cathodes for Electron Beam Evaporation, Cathodes and Anodes for Ion Implantation, Tubes / Boats for Sintering of Capacitors, Targets for X-ray Diagnostics, Crucibles, Heating Elements, X-ray Radiation Shielding, Sputtering Targets and Electrodes.

    Phone

    022 - 5921 - 3388

    ATTL Advanced Materials Co., Ltd.

    Phone：022 - 5921 - 3388
    113168011

    Email: sales@attl.cn

    Address: 10 Baozhong Ave, Baodi Economic Development Zone, Tianjin

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