Product Brief Introduction:

W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience. The thermal expansion can be adjusted to match with the following material: 

(1) Ceramic materials: Al₂O₃(A-90,A-95,A-99),BeO(B-95, B-99),AlN,etc;
(2) Semiconductor materials: Si, GaAs, SiGe,SiC, GaP,GaAs;
(3) Metal Material: Kovar alloy(4J29), 42 alloy;

The quality of our composite is the leader in China, contributed with our strict quality control measures. Our porosity is very low; our surface/volume ratio (measured with BET) is only 50% of similar products in the market. (Based on the measurements of 100 pieces of 5*5*2 mm W80-Cu20 composite). Our products have high hermeticity and can pass the He mass-spectrometor leak test.(<<5*10^-9Pa·m³/S).

Our Tungsten Copper Composite Features:

- No Fe, Co, Ni, Mn and other elements added as the sintering activator, to maintain a high thermal conductivity

- Excellent hermeticity

- Can provide semi-finished or finished (Ni/Au plated) products

- Precision machining and excellent dimensional control, surface finish and flatness

- With close technical supports including product design, custom manufacturing, testing and post sale supports.

Product Properties:

Physical Properties of Major Products

Application: