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    Home > Products > Heat Sinks for Electronic Packaging
    Molybdenum Copper (Mo-Cu)

    Molybdenum Copper (Mo-Cu)

    Product Brief Introduction:

    Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.


       

    Product Properties:

    Physical Properties of Major Products

    Material Molybdenum Content Wt% Copper COntent Wt% Density g/cm3 Thermal conductivity at 25℃ W/(M.K) Coefficient of thermal
    expansion at 20℃
    (10-6/K)
    Mo85Cu15 85± 1 Balance 10 160 - 180 6.8
    Mo80Cu20 80 ± 1 Balance 9.9 170 - 190 7.7
    Mo70Cu30 70 ± 1 Balance 9.8 180 - 200 9.1
    Mo60Cu40 60 ± 1 Balance 9.66 210 - 250 10.3
    Mo50Cu50 50 ±0.2 Balance 9.54 230 - 270 11.5

    Application:

    These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

    Phone

    022 - 5921 - 3388

    ATTL Advanced Materials Co., Ltd.

    Phone：022 - 5921 - 3388
    113168011

    Email: sales@attl.cn

    Address: 10 Baozhong Ave, Baodi Economic Development Zone, Tianjin

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