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    Home > Products > Heat Sinks for Electronic Packaging
    Cu/Mo/Cu(CMC)

    Cu/Mo/Cu(CMC)

    Product Brief Introduction:

    Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.


    The features of copper molybdenum copper:

    - Large sized sheets available

    - Can be stamped into components

    - Strong interface bonding resist to 850℃ heat shock repeatedly

    - Tailorable CTE matching that of semiconductor and ceramics

    - High thermal conductivity


      

    Product Properties:

    Material Density at 20℃ g/cm3 Coefficient of thermal expansion at 20℃ (10-6/K) Thermal conductivity at 25 ℃ W/(M.K)
    In - plane Thru - thickness
    13:74:13 9.88 5.6 200 170
    1:4:1 9.75 6.0 220 180
    1:3:1 9.66 6.8 244 190
    1:2:1 9.54 7.8 260 210
    1:1:1 9.32 8.8 305 250

    Application:

    - These composite are widely used in applications such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts. etc.
    - Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mounts.

    Phone

    022 - 5921 - 3388

    ATTL Advanced Materials Co., Ltd.

    Phone：022 - 5921 - 3388
    113168011

    Email: sales@attl.cn

    Address: 10 Baozhong Ave, Baodi Economic Development Zone, Tianjin

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