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    Home > Products > Heat Sinks for Electronic Packaging
    Cu/MoCu/Cu(CPC)

    Cu/MoCu/Cu(CPC)

    Product Brief Introduction:

    Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.


    Features of Cu/Mo70Cu/Cu:

    - Large sized sheets available

    - More easily to be stamped into components than CMC

    - Very strong interface bonding which can repeatedly resist 850℃ heat shock

    - Higher thermal conductivity and lower cost


      

    Product Properties:

    Material Density at 20℃ g/cm3

    Coefficient of thermal expansion at 20℃

    (10-6/K)

    		Thermal conductivity at 25 ℃ W/(M.K)
    In - plane Thru - thickness In - plane Thru - thickness
    1:4:1 9.4 7.2 9.0 340 300

    Application:

    Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages,GaAs device mount.

    Phone

    022 - 5921 - 3388

    ATTL Advanced Materials Co., Ltd.

    Phone：022 - 5921 - 3388
    113168011

    Email: sales@attl.cn

    Address: 10 Baozhong Ave, Baodi Economic Development Zone, Tianjin

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