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Tungsten Molybdenum Tungsten Copper Molybdenum Copper Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC) Glid Copper Oxygen-free Copper (OFC) Low CTE Alloys

Glid Copper

Product Brief Introduction:

Glid Copper refers to a family of Copper-based metal matrix composite (MMC) alloys mixed primarily with aluminum oxide ceramics particles. The addition of small amounts of aluminum oxide has minuscule effects on the performance of the copper at room temperature (such as a small decrease in thermal and electrical conductivity), but greatly increases the copper’s resistance to thermal softening and enhances high elevated temperature strength. Glid has higher hardness value (HV > 125) and tensile strength (>350 MPa), compared to OFC’s HV40 and 250 Mpa.

he addition of aluminum oxide also increases the thermal conductivity or electrical conductivity is required while also maintaining strength at elevated temperatures or radiation levels.

Product Properties:

Material	Melting Point	Softening Temperature	Density at 20 ℃ g/cm³	Thermal conductivity at 25℃ (10^-6/K)	Coefficient of thermal expansion at 20℃ W/(M.K)
C15715	1083 ℃	800 ℃	8.84	365	17.6
C1560	1083 ℃	910 ℃	8.81	322	17.6

Composition and Physical properties of various grades of Glid Copper compared to oxygen-free copper (OFC) (at room temperature unless otherwise noted).
UNS Alloy Number	Aluminum Oxide Content	Melting Point	Density g/cm³ lb/in³	Electrical Conductivity	Electrical Conductivity W/(M.K)	Coefficient of Thermal Expansion (range 20-150℃, 68-300 ^oF)	Modulus of Elasticity
OFC	0 %	1,083℃ (1,981 oF)	8.94 (0.323)	58 Meg S/m (101 % IACS)	391 wat/m/OK (226 BTU/ft/hr/OF)	17.7 μm/m/℃ (9.8 μ-in/in/OF)	115GPa (17 Mpsi)
UNS- C15715	0.3 wt. %	1,083℃ (1,981 oF)	8.90 (0.321)	54 Meg S/m (92 % IACS)	365 wat/m/OK (211 BTU/ft/hr/OF)	16.6μm/m/℃ (9.2 μ-in/in/OF)	130GPa (19 Mpsi)
UNS- C15760	1.1 wt. %	1,083℃ (1,981 oF)	8.81 (0.318)	45Meg S/m (78 % IACS)	322 wat/m/OK (186 BTU/ft/hr/OF)	16.6μm/m/℃ (9.2 μ-in/in/OF)	130GPa (19 Mpsi)

Additional materials and elements can be added if lower thermal expansion is required, or higher room temperature and elevated temperature strengths. The hardness can also be increased.

A composite material of Glid AL-60 and 10% Niobium provides high strength and high conductivity.

The hardness is comparable to many copper-beryllium and copper-tungsten alloys, while the electrical conductivity is comparable to RWMA Class 2 all.